Yole Group released its Status of the Advanced IC Substrates Industry 2025 report, projecting a $31 billion market for advanced IC substrates (AICS), glass core substrates (GCS), substrate-like PCBs (SLP), and embedded die (ED) technologies by 2030.
The report highlights recovery and growth across these technologies, fueled by AI, high-performance computing (HPC), and expansion in consumer, automotive, and defense sectors. In 2024, the organic AICS market grew 1% year-over-year to $14.2 billion, with build-up IC substrates holding a significant and increasing market share, driven by demand for complex, high-average-selling-price substrates for generative AI, data centers, and advanced packaging needs. GCS, still in early stages, is advancing toward commercialization with investments in the U.S., Korea, and China, including Absolics’ Georgia-based fab and global pilot lines, targeting a multi-hundred-million-dollar market by 2030 for HPC, AI, and telecommunications. SLP shipments reached 392 million units in 2024, primarily driven by smartphone applications, with emerging demand from AR/VR, wearables, and flagship mobile devices.
The SLP market is projected to grow to over $5 billion by 2030 at a 4.5% CAGR. ED technology, though niche, supports power delivery and signal integrity for AI chips, particularly in automotive and industrial applications. Companies like ASE, AT&S, Würth Elektronik, and Texas Instruments are exploring ED integration, but high costs and a fragmented supply chain limit growth. Global capacity expansion is driven by AI/HPC trends, CHIPS Act incentives, and Chinese investments, with players like Zhen Ding committing up to $1 billion.
Asia, led by suppliers such as Unimicron, Ibiden, Shinko, Semco, and AT&S, dominates organic AICS manufacturing. U.S. and European players, supported by government programs, are expanding but trail in production capacity. The materials supply chain is diversifying, with new entrants challenging established build-up material providers to address bottlenecks. The report underscores the evolving role of advanced IC substrates as critical enablers of semiconductor performance and system integration. Yole Group’s analysts will discuss these findings at the Glass Substrate & Packaging Industry Chain Expo in China from August 26-28, 2025.
