FlexTech, a SEMI Technology Community, has opened a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, focusing on advanced materials and additive processing. The RFP, funded by the Army Research Laboratory (ARL), offers cash awards between $250,000 and $750,000 for selected projects, with ARL funding matched by contributions from recipients to cover total project costs. Proposals are due by July 14, 2025.
The RFP targets advancements in:
Advanced Materials
Integrated Digital Twin Platforms for Multiscale, Multimaterial, Additive Electronics Manufacturing
System Integration, Reliability, and Standards for Scalable FHE and Additive Electronics Manufacturing
Restricted Open Topics
Market & Application Landscape Assessment
Process Development Kit for FHE
3D Geometry & Co-Design Tools
Organizations will be evaluated based on their capabilities, experience, and strengths. The evaluation process is detailed in the FlexTech 2025 RFP. White paper submissions, the initial step, are due by July 14, 2025. A review committee, comprising FlexTech Council members and subject matter experts, will assess submissions based on rationale, budget, collaboration value, dual-use applicability (industry and military), relevance to the FHE ecosystem, schedules, milestones, deliverables, and proposal quality. Selected organizations will be invited to submit full proposals.
FlexTech will host a webinar on June 24, 2025, at 10:00 a.m. PDT to discuss RFP topics and the submission process. A recording will be available for registrants unable to attend. Registration is open for the webinar.
FlexTech RFPs support both high-risk, revolutionary technical approaches and evolutionary improvements to existing capabilities, with the latter involving shorter development timelines. The community encourages collaborations among industrial companies, R&D organizations, and university teams. Development partners retain intellectual property ownership under FlexTech agreements. For inquiries, contact flextechrfp@semi.org.
