The SEMI 3D & Systems Summit, scheduled for June 25-27, 2025, in Dresden, Germany, will address advancements in semiconductor packaging and integration under the theme "Heterogeneous Integration: Bolstering Europe's Resilience." The event will cover topics including geopolitical dynamics and market trends in the global semiconductor landscape, chiplet applications and system-level architectures, hybrid bonding technologies for die-to-wafer and wafer-to-wafer integration, photonics and co-packaged optics, innovation and sustainability in 3D integration, European readiness in design, materials, and manufacturing, and career development for next-generation talent. Registration is open.
Featured speakers include Christian Koitzsch (European Semiconductor Manufacturing Company), Dave Thomas (SPTS Technologies, KLA), Dirk Drescher (Robert Bosch Semiconductor Manufacturing Dresden), Georg Roell (RANOVUS Inc.), Isabella Drolz (Comet), Jan Vardaman (TechSearch International), Jekaterina Viktorova (Syenta), Peter Jenkins (Infinitesima), Seung Kang (Adeia), Sébastien Dauvé (CEA-Leti), Stephan Guttowski (Fraunhofer Group for Microelectronics), and Thomas Kralinski (Saxon State Secretary of Economic Affairs, Labour, Energy and Climate).
Networking events include a reception at the Hilton Dresden Hotel on the first day and a Networking Dinner Cruise on a historic paddle steamer on the Elbe River, reserved exclusively for summit participants. The exhibition area will feature companies such as AEMtec GmbH, Adeia Inc., ASE Global, ASMPT, Besi, Carl Zeiss, Comet, Confovis, cyberTECHNOLOGIES, DISCO HI-TEC Europe, FAMES, Fraunhofer IZM-ASSID, Fraunhofer - Verbund Mikroelektronik, Heidenhain, Kistler AG, Kontron AIS, NanoFocus AG, PLANOPTIK, Precitec Optronik GmbH, SET, Syenta, and Wooptix. Premium sponsors include Adeia, ASE, Comet, Confovis, CTP, Evatec, EV Group, HEIDENHAIN, KLA, imec, Lam Research, and MKS Atotech.
