Keysight announced a strategic collaboration with Intel Foundry to advance Embedded Multi-die Interconnect Bridge-T technology. This cutting-edge innovation is set to enhance high-performance packaging solutions for AI and data center markets, supporting the Intel 18A process node.
By adopting these standards and verifying chiplets for compliance and link margin, Keysight EDA and Intel Foundry contribute to a growing chiplet interoperability ecosystem. The collaboration aims to reduce development costs, mitigate risk, and accelerate innovation in semiconductor design.
Keysight EDA’s Chiplet PHY Designer, the latest solution for high-speed digital chiplet design tailored to AI and data center applications, now offers advanced simulation capabilities for the UCIe 2.0 standard and introduces support for the Open Compute Project BoW standard. As an advanced, system-level chiplet design and die-to-die design solution, Chiplet PHY Designer enables pre-silicon level validation, streamlining the path to tapeout.
Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry, said: “Our collaboration with Keysight EDA on EMIB-T silicon bridge technology is a pivotal step in advancing high-performance packaging solutions. By integrating standards like UCIe 2.0, we enhance chiplet design flexibility for AI and data center applications, accelerating innovation and ensuring our customers meet next-generation demands with precision.”
Niels Faché, Vice President and General Manager, Keysight’s Design Engineering Software, added: "Keysight EDA's pioneering Chiplet PHY Designer continues to redefine pre-silicon validation, empowering chiplet designers with rapid, accurate verification. By proactively embracing evolving standards like UCIe 2.0 and BoW, and now with critical support for Intel Foundry’s EMIB-T, we're enabling engineers to accelerate innovation and eliminate costly design iterations before manufacturing."
Learn more at www.keysight.com.



