Sachin Tendulkar invested RRP Electronics has formed strategic alliance with US-based Deca Technologies, where RRP to integrate Deca’s innovative Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes.
Rajendra K. Chodankar, Chairman & CEO of RRP Electronics said “We are investing in a large-scale Technology Transfer License Agreement (TTLA) with Deca, potentially on exclusive terms, to create a fully automated, world-class infrastructure. This partnership will take semiconductor packaging in India to new heights. We aim to complete our qualification tests by August 2025 and foresee revenue exceeding USD 30 million (about Rs260 crore) in just the second year of operations, with exponential growth in the years to come”
Tim Olson, Founder & CEO of Deca Technologies, added, “We are thrilled to be part of India’s ambitious semiconductor growth story. RRP Electronics’ vision, expertise, and determination make them the perfect partner to drive innovation in semiconductor packaging. This collaboration will accelerate their ambitious plans and strengthen India’s position in the global semiconductor value chain”
RRP Electronics is investing Rs 5000 Crore over 5 years in OSAT facility in Maharashtra.
RRP with state-of-the-art production facility spread across 43,000 square feet is initially targeting QFN / DFN / BGA / SOIC / TSSOP semiconductor chip packages and other advanced packages by installing brand new and latest versions of semiconductor equipment.
