Neuranics and Hprobe have partnered to use automated wafer probing technology for TMR (Tunnel Magnetoresistance) sensor development, measuring hundreds of sites across a wafer under controlled 3D magnetic field conditions.
The wafer-level measurements take place before devices are diced and packaged. The approach allows Neuranics to characterize hundreds of sensor sites across an entire wafer rather than evaluating a handful of packaged devices, providing richer datasets and faster feedback for sensor development.
The data will provide insight into sensitivity, offset and noise across wafers, supporting design iterations, device performance optimization and future product development. The partnership's technical activities will also cover measurement methodologies, device integration and exploration of future multi-axis sensing solutions.
Neuranics CEO Noel McKenna said wafer-level characterization could accelerate the company's development cycle by providing measurements across hundreds of sites, enabling faster design optimization and validation of new concepts.
The agreement also provides for research engagement and talent development to help build skills and expertise for the growth of the magnetic sensing ecosystem.
