Tower Semiconductor showcases silicon photonics and SiGe solutions for AI at ECOC 2026

Tower Semiconductor will participate in ECOC 2026, taking place September 21-23 at FYCMA in Malaga, Spain, at booth #C1014. Throughout the event, company representatives will be available to meet with attendees to discuss Tower's current and future silicon photonics roadmap.

Tower plans to showcase its high-volume, high-performance Silicon Photonics platform, which is already widely used across the industry for data center and telecom optical transceivers, the components that convert data between optical and electrical signals for fiber communication. The company will also highlight the platform's role in a range of newer, high-growth applications, including near- and co-packaged optics (NPO/CPO), which integrate optical components closer to or directly alongside chip packaging for next-generation AI cluster architectures; DWDM lasers, which support transmitting multiple data channels over different wavelengths of light on a single fiber; optical circuit switching; frequency-modulated continuous-wave (FMCW) LiDAR for physical AI applications like robotics and autonomous systems; and quantum computing.

Alongside its silicon photonics platform, Tower will also feature its Silicon Germanium (SiGe) BiCMOS solutions, a semiconductor technology that combines bipolar and CMOS transistor types to handle high-frequency signals efficiently. Tower positions these SiGe solutions as complementing its silicon photonics platform, together addressing the higher bandwidth, lower latency, and lower power requirements of next-generation AI infrastructure.