MacDermid Alpha Electronics Solutions will highlight materials for circuit board protection, electronics assembly, and advanced power and semiconductor applications at Productronica India 2026, scheduled for September 16-18 at the Bangalore International Exhibition Centre in Bengaluru.
The company stated that electronic systems are becoming denser, more powerful, and more sophisticated, increasing demands on materials used to protect them and ensure reliable performance throughout their operating life. MacDermid Alpha’s materials and process technologies address these requirements across circuit board protection, electronics assembly, and power and semiconductor applications.
Among the technologies on display is Electrolube UVFlex, a UV-curable conformal coating. UVFlex cures rapidly under UV light, with a secondary moisture-cure mechanism that protects areas not directly exposed during processing. Its chemistry supports performance under thermal and environmental conditions. The formulation is PFAS-free and contains 25 to 30% bio-based content.
Padmanabha Shakthivelu, Director of Product Management at MacDermid Alpha Electronics Solutions, said: “The demands on electronic assemblies continue to increase, both in production and in the environments where they ultimately operate. UVFlex was developed to respond to both, combining efficient UV processing with the thermal and electrical performance needed for long-term reliability. That combination is especially relevant as manufacturers look to improve process efficiency while designing for more demanding applications.”
Additional technologies on display include ALPHA OM-377 solder paste for ultra-fine-feature printing, ALPHA OM-100 SnCX 07 silver-free solder paste with enhanced mechanical strain resistance, and ALPHA EF-6038HF no-clean flux with ultra-low residue and hole filling. For power electronics, Argomax® silver sintering and the ATROX die attach portfolio will be shown. The Micromax portfolio will also be featured, including LTCC materials for telecom and defense, materials for passive components, and Green Tape materials for probe card applications.
These technologies cover materials and process expertise across circuit board protection, precision assembly, thermal management, and interconnect reliability.
MacDermid Alpha’s technical experts will be available at Booth H4.G35 throughout Productronica India 2026 to discuss application challenges, material considerations, and developments across electronics manufacturing.
