Baya Systems and AdoreSys collaborate to enhance semiconductor IP access in Asia-Pacific

Baya Systems, a developer of software-driven fabric and system IP solutions, and AdoreSys, a semiconductor design solutions provider, have announced a strategic partnership to offer Baya's WeaveIP fabric and WeaverPro software platform together with AdoreSys' ASIC design, integration, and implementation expertise, packaged as a combined solution for semiconductor and systems companies in China and the broader Asia-Pacific region.

Through the partnership, AdoreSys will provide access to Baya's technology alongside its own design and implementation services, creating a more connected path spanning system architecture and design through actual silicon implementation. The collaboration is aimed at helping customers manage increasingly complex data-movement challenges across AI, data center, automotive, and high-performance computing applications.

Sailesh Kumar, CEO of Baya Systems, said that as Baya continues scaling globally, AdoreSys provides the local relationships and deep design expertise that can help expand the company's reach in China and strengthen its presence across the wider Asia-Pacific region. He said there's a clear need for more flexible, data-movement-focused technology, and that together with AdoreSys, the companies can bring those capabilities to more customers across the region.

KengSu Teoh, CEO of AdoreSys, said that as one of the world's fastest-moving semiconductor markets, succeeding in Asia requires innovating quickly. He said AdoreSys' focus markets, including high-performance computing, data centers, and automotive, increasingly demand a new generation of data-movement technology, and that Baya's software-driven approach aligns closely with AdoreSys' own vision, helping customers explore and optimize advanced chip architectures faster and move more efficiently from initial concept to finished silicon.

Baya's WeaverPro software platform supports early architectural exploration and optimization, while its WeaveIP portfolio provides scalable, high-performance fabric IP, the underlying interconnect technology that moves data between different parts of a chip, for actual implementation. Combined with AdoreSys' ASIC expertise and regional presence, the partnership is designed to let customers optimize data movement, performance, and power consumption while speeding up development of complex systems-on-chip (SoCs) and multi-die systems, and reducing design challenges along the way. By combining architecture exploration, fabric technology, and implementation expertise, Baya and AdoreSys say they aim to give customers a more efficient path from initial concept through to finished silicon.