Navitas Semiconductor has introduced a new packaging format for its silicon carbide MOSFETs called the UHV-TO-247-4-ISO that tackles one of the most persistent headaches in high-power electronics design: managing heat while maintaining safe high-voltage isolation, all in a compact form factor.
In high-power systems think grid infrastructure, battery storage, or industrial converters engineers have always had to choose between good thermal management and electrical isolation. Getting heat out efficiently usually means mounting the device directly onto a heatsink, but that creates a safety and EMI risk unless you add external isolation materials in between. Those external layers add cost, complexity, bulk, and introduce failure points.
The new package integrates an Aluminum Nitride (AlN) substrate directly inside the package itself, built using Active Metal Brazing (AMB) technology. This does several things at once:
· Provides over 6,000V of built-in isolation eliminating the need for external ceramic isolators or thermal interface pads
· Allows the device to mount directly onto liquid- or air-cooled heatsinks without any intermediate isolation layer
· Reduces thermal resistance between the junction and heatsink by up to 60%, which translates to up to 150% more power dissipation capability meaning you can push more power through the same space
· Lowers stray capacitance between the die and heatsink, which reduces common-mode noise and radiated EMI enabling higher switching speeds without expensive EMI mitigation hardware
Critically, it uses the standard TO-247-4 footprint meaning existing board designs require zero modification. Engineers get module-class performance in a familiar discrete package, without a redesign penalty.
Available in 1200V, 2300V, and 3300V ratings, the package targets:
· Grid-tied power conversion systems
· Solid-state transformers
· Battery energy storage systems (BESS)
· Renewable energy applications
· AI data center power infrastructure
Navitas will have the package and its direct-cooled heatsink assembly on display at PCIM Europe 2026 in Nuremberg, Hall 9, Booth 544, June 9–11.
