Vishay Intertechnology, announced its new thin film submount platform. The platform is designed for next-generation optical transceivers, RF modules, and advanced electronic packaging applications that require high thermal performance, precision alignment, and high frequency signal integrity.
Vishay’s platform uses precision deposition of passive circuit elements and precision machining of advanced ceramic substrates, including aluminum nitride. It targets emerging applications in high speed data communications, including 800G, 1.6T, and 3.2T optical transceivers, where power densities and packaging constraints demand enhanced heat dissipation, precise alignment, and low loss interconnect performance.
“Next-generation photonics and RF systems push the limits of thermal, mechanical, and electrical performance at the package level,” said Michael Casper, vice president of specialty thin film at Vishay. “Our thin film submount platform provides engineers with a flexible solution that enables high performance without compromising reliability.”
Key features of the platform include:
- Quick-turn prototyping with high volume production capability from three manufacturing locations
- High thermal conductivity through AlN-based substrates for efficient heat dissipation in high power devices
- High frequency performance with low loss thin film interconnects for microwave and millimeter-wave applications
- Miniaturization through compact, integrated designs
- Reduction in manufacturing complexity via pre-deposited AuSn or EPIG and precision machining
- Design flexibility with tailored geometries, metallization schemes, and circuit integration
The thin film submount platform is proven in applications such as laser diode mounting, RF/microwave modules, optical alignment, combined wire bond and SMT processes, and hermetic packaging solutions. It is used in defense, space, and high reliability industrial applications.
Vishay sampling and supports custom designs now through global production capabilities.
