Smiths Interconnect announces the launch of DaVinci Gen V, the latest evolution in its flagship DaVinci series of semiconductor test sockets.
Engineered to meet the rigorous demands of next-generation technologies, DaVinci Gen V delivers unmatched performance in signal integrity and impedance tuning—two of the most critical challenges in semiconductor testing. This innovation is poised to accelerate the development and deployment of advanced integrated circuits used in AI accelerators, automotive systems, and 6G communications infrastructure.
Unprecedented Speed: Supports digital signaling up to 224 Gbps PAM4 and frequencies beyond 100 GHz, enabling ultra-high-speed data transmission for AI and 6G applications.
Scalable Design: Accommodates a 40% increase in ASIC sizes, supporting the growing complexity of system-on-chip architectures.
Seamless Integration: Fully compatible with existing test hardware, reducing development cycles and accelerating time-to-market.
Robust Performance: Long contact life tested to 500,000 insertions, ensuring durability and reliability in high-volume production environments.
Advanced Signal Integrity: Features a patented insulated metal socket housing for optimal signal fidelity and mechanical strength.
Custom Impedance Matching: Tunable to match system requirements or defined specifications, ensuring maximum signal power transfer.
As integrated circuits continue to double in bandwidth and computational power every two years, DaVinci Gen V is designed to evolve alongside them. Its high-speed capabilities and robust architecture make it an essential tool for manufacturers pushing the boundaries of innovation in AI, telecommunications, and automotive electronics.
With DaVinci Gen V, Smiths Interconnect reaffirms its position at the forefront of semiconductor test technology—delivering solutions that are not only high-performing but also future-ready.
For more information, visit https://www.smithsinterconnect.com
