StratEdge Launches Gold Plated Tabs for Eutectic Die Attach in GaN High-Power RF Applications

StratEdge Corporation offers gold plated tabs for advanced semiconductors that require high thermal and electrical performance in high-power RF, microwave, and power applications.

The tabs are designed to support eutectic die attach for gallium nitride (GaN) and other high-power devices using gold-tin (AuSn) and gold-silicon (AuSi) solders. They provide a die-on-tab solution for situations where direct eutectic attach to an organic board is not suitable due to temperature limitations.

In chip-on-board applications, the semiconductor chip is attached to the thermally conductive tab before the tab is installed onto the board. This process protects temperature-sensitive board materials while meeting the requirements of high-frequency and high-power devices. Phased array designers can use the board to combine multiple antenna elements in space-constrained environments.

“Gold plated tabs give engineers a reliable path for integrating advanced devices into demanding RF, microwave, and power applications,” said Casey Krawiec, vice president of Global Sales at StratEdge. “For high-power density semiconductors, having a reliable first-level interface is extremely important. Our tabs help our customers achieve this.”

StratEdge’s packaging and assembly capabilities are detailed in the company’s white paper, *Die-on-Tab for...