Molex has completed the acquisition of Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.
The acquisition adds detachable wafer-level fiber-to-chip connectivity to Molex’s portfolio, supporting scalable co-packaged optics.
"Teramount's passive, detachable coupling approach supports large assembly tolerances and semiconductor-grade wafer-level processes—filling a critical gap in the optical stack," said Aldo Lopez, president, Datacom Solutions, Molex. "By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era."
Teramount will continue to operate as a design and engineering hub in Jerusalem, supported by Molex’s global optical capabilities. It will become part of the Optical Connectivity segment within the Optical Solutions Business at Molex.
Financial terms of the transaction were not disclosed.
