SK hynix started sampling world's first 12-layer HBM4 (High Bandwidth Memory) DRAM to its major customers. SK hynix calling it a significant milestone in AI memory technology, where it has delivered ahead of schedule, underscoring SK hynix's technological leadership and production expertise in the HBM market.
The 12-layer HBM4 DRAM to significantly improve AI applications performance. These chips feature 60% higher data-speed bandwidth than the previous generation to handle 2TB of data per second, that's more than 400 full-HD movies (5GB each) in just one second.
Key Technical Specifications
Bandwidth: Over 2TB of data per second, translating to more than 400 full-HD movies in a second.
Capacity: Each 12-layer stack boasts a capacity of 36GB, the highest among 12-layer HBM products.
Interface: A 2048-bit interface per stack, supporting transfer speeds up to 6.4 GT/s.
Advanced MR-MUF Process: Enhances product stability and heat dissipation, preventing chip warpage.
SK hynix is on track to complete the certification process for these samples and aims to kick off mass production in the second half of 2025.
"We are thrilled to deliver the world's first 12-layer HBM4 DRAM samples to our customers ahead of schedule," said a spokesperson for SK hynix. "This achievement underscores our relentless commitment to pushing the boundaries of technology and providing top-tier solutions for the AI ecosystem."
As the AI industry continues to surge, the demand for high-performance memory solutions like the 12-layer HBM4 DRAM is expected to skyrocket, positioning SK hynix at the forefront of HBM Memory market.
