TDK Corporation has expanded its surface-mount multilayer varistor (MLV) family with the standard X series (CT0402*X, CT0603*X, CT0805*X, CT1206*X, CT1210*X, CT1810*X, and CT2220*X) for industrial applications, with a CO₂ footprint reduction of up to 30 percent. The components protect electronics against overvoltages and target power supplies, factory automation, industrial IoT, and sensor interfaces, including applications in harsh environments.
The X series uses a tailored ceramic composition that can be sintered at lower temperatures than standard MLVs, reducing energy usage. Its raw material also has a smaller CO₂ footprint. The series follows the release and ramp-up of the X1 series for automotive applications, which is based on the same technology platform.
The X series spans case sizes from EIA0402 to EIA2220, with RMS voltage ratings from 3.5 to 40 V, varistor voltages from 8 to 350 V, and clamping voltages from 24 to 450 V. It withstands electrostatic discharge (ESD) up to 15 kV air discharge according to IEC 61000-4-2, while peak current handling ranges from 1 A in the smallest footprint to 800 A. The varistors respond to voltage transients within 0.5 ns and offer capacitance values as low as 6 pF to preserve signal integrity in high-speed data lines. They operate from -55 to +125 °C, and packaging options support high-volume automated assembly in modern SMT processes. Customer-specific adjustments are possible.
Key features of the X series include reliable ESD protection up to 15 kV air discharge according to IEC 61000-4-2; low leakage current; no temperature derating up to +125 °C; high lifetime robustness; and a stable protection level.
