Nordson Electronics Solutions has introduced the ASYMTEK Vantage XL, a new fluid dispensing system designed specifically to handle the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging processes.
The Vantage XL extends Nordson's existing Vantage dispensing platform to accommodate larger panel formats, letting manufacturers develop next-generation packaging processes and scale up production with better accuracy, throughput, and process control.
Panel-level packaging offers higher throughput and lower manufacturing costs compared to traditional wafer-level processes, an advantage that's becoming increasingly important as package sizes grow and demand accelerates for AI applications and electrified automotive systems. However, scaling up to larger panel formats introduces its own challenges, including managing warpage (unwanted bending or distortion of the panel), controlling heat, and maintaining precise dispensing accuracy, all of which require specialized process controls to manage effectively.
Built specifically to address these panel-level packaging challenges, the ASYMTEK Vantage XL offers several capabilities. It improves how underfill material, the adhesive material dispensed beneath a chip to secure and protect it, flows during dispensing, helping mitigate warpage and avoid voids in the finished result. It supports flexible tooling to accommodate large panel sizes during manufacturing. It includes integrated thermal management for rapid, even heating across the substrate. It uses multi-fiducial capture, meaning it can quickly and accurately align to multiple reference points on a panel. It includes confocal height sensing, a precise optical measurement technique that works on both reflective and transparent glass panels. And it supports post-dispense inspection to allow efficient rework when needed. The system is based on Nordson's established Vantage dispensing platform, adapted into a larger frame to accommodate common panel sizes used in the industry.
The new ASYMTEK Vantage XL system will be on display at SEMICON Taiwan 2026, at booth #I2308. Nordson will also be highlighting its new MARCH ExoSPHERE plasma treatment system at the event, which supports advanced packaging processes by providing consistent surface preparation across panels and wafers. SEMICON Taiwan 2026 will take place at TaiNEX Hall 1 in Taipei, Taiwan, from September 2-4, 2026.
