Manz Asia, a provider of semiconductor advanced packaging equipment and process solutions, has developed production-ready electrochemical deposition (ECD) platforms supporting three panel formats: 310mm, 510mm, and 700mm. ECD is a manufacturing process that deposits metal layers onto a surface using an electrical current, commonly used to build the fine copper wiring layers found in advanced chip packaging. Building on ECD as its core technology, Manz Asia integrates other key wet processing steps, including cleaning, developing, etching, and stripping, into its Omni 310, Omni 510, and Omni 700 platforms to support scalable manufacturing of redistribution layers (RDL) at the panel level.
RDL refers to the wiring layer that reroutes electrical connections on a chip package so they line up properly with the rest of the system, and it's becoming increasingly important as chip designs grow more complex. As AI and advanced computing drive more complex chiplet-based architectures, meaning designs built from multiple smaller chips combined together, larger interposers and substrates are becoming necessary to fit more of these components into a single package. This is pushing the industry away from traditional 300mm wafer-based manufacturing toward larger panel formats, while making RDL technology increasingly important for creating the dense interconnects these more complex packages require.
Drawing on its expertise across equipment and process integration, Manz Asia addresses these evolving requirements by combining ECD and several wet processing steps into a single, unified equipment lineup. The company says this approach helps manufacturers simplify how they integrate different manufacturing processes, reduces the complexity of managing multiple equipment suppliers, and gives them more flexibility across different panel sizes and packaging architectures.
The Omni Series supports several advanced packaging approaches, including fan-out panel-level packaging (FOPLP), chip-on-panel-on-substrate (CoPoS), and Glass Core TGV (through-glass via) technology, with proven use in power management ICs (PMIC) and RF devices for communications and automotive markets. The platform is also positioned as a foundation for continued technology development to meet emerging AI and high-performance computing packaging requirements.
On Glass Core TGV specifically, a newer packaging approach gaining traction, manufacturing through-glass vias requires precise micromachining of glass, forming tiny vias (vertical connection holes), metallizing those vias, and filling them with metal at a high aspect ratio, meaning the vias are much deeper than they are wide. Manz Asia is extending its etching and ECD technology to meet these requirements. Its glass etching equipment supports substrates up to 0.4mm thick and can create microvias as small as 20 microns, with the resulting via structures achieving aspect ratios of up to 1:20, allowing for precise, controlled formation. For metallizing these vias, the company's ECD technology supports filling high-aspect-ratio vias and can be paired with seed-layer sputtering, a technique for depositing a thin conductive base layer, and plating chemistry to achieve void-free copper filling and consistent metal deposition, addressing key requirements around fill quality, plating uniformity, and structural reliability in Glass Core TGV manufacturing.
Robert Lin, CEO of Manz Asia, said AI-driven semiconductor growth is accelerating the evolution of advanced packaging, pushing toward greater integration, larger package formats, and more complex interconnect architectures. He said RDL technology is becoming a critical piece of connecting chips, interposers, substrates, and printed circuit boards across emerging architectures like CoPoS, FOPLP, and Glass Core TGV.
Lin added that the company's 310mm, 510mm, and 700mm production-proven RDL platforms reflect its commitment to scalable manufacturing across a range of packaging architectures and substrate formats, and that by offering a broad portfolio covering most of the key steps involved in RDL manufacturing, Manz Asia helps customers simplify supplier coordination, streamline process integration, and deploy more efficient production setups.
He said Manz Asia's role extends beyond simply supplying equipment, noting that the company works closely with customers to bridge the gap between early-stage process innovation and full high-volume manufacturing, with a focus on productivity, yield, and cost efficiency. By combining process expertise, equipment integration, and ongoing innovation, he said the company aims to accelerate adoption of panel-level packaging and contribute to a stronger advanced packaging ecosystem for the AI era.
