Communication
Photonic IC powered 6.4Tbps CPO with integrated laser for AI/ML application
Ranovus said it has been collaborating with MediaTek to deliver a 6.4Tbps co-packaged optics solution for MediaTek’s next generation ASIC design platform. MediaTek unveiled its next-generation custom ASIC design platform, integrating high-speed electrical and optical I/Os within the same ASIC imp
4 min read
Mitsubishi sampling DFB-CAN with built-in wavelength monitor for digital coherent communication
Mitsubishi to start shipping sampling of its latest optical device, a DFB1-CAN with built-in wavelength monitor from 1st Apr 2024. Mitsubishi said this innovative new light source is the industry’s first to use the TO-56CAN 3 package for digital coherent communication capable of high-speed, long-
4 min read
Broadcom's 51.2 Tbps co-packaged optics ethernet switch enabling 70% power saving in Gen AI clusters
Broadcom is becoming a key part of exponential AI growth in the years of 2023 and 2024, where its high-speed interconnet products are used extensively in today's Gen-AI and such AI server/cloud systems. To address the growing demand of high speed and low power it has announced shipment of its new
7 min read
Braodcom claims volume leadership in VCSEL, EML and CWL optical components in AI market
Broadcom is extensively using silicon photonics in its chips and also claims it has achieved several major accomplishments extending its market leadership with an expanded portfolio of optical interconnect solutions for artificial intelligence (AI) and machine learning (ML) applications basically en
2 min read
IEEE approves Panasonic's OFDM based Nessum as new IEEE 1901c standard
Panasonic has developed an innovative communications technology based on Wavelet orthogonal frequency division multiplexing (OFDM) method, to enable seamless communication across various mediums. IEEE Standards Association Board of Directors has approved it as the new IEEE 1901c standard. Panasonic
3 min read
Photonics semiconductor expert Dr. Radha Nagarajan of Marvell wins 2024 David Richardson Medal from Optica
Marvell announced that Dr. Radhakrishnan (“Radha”) Nagarajan has been selected as the 2024 recipient of the David Richardson Medal by Optica. He is honored for the successful manufacturing and commercialization of InP and Si-based photonic integrated circuits for use as optical interconnects with a
3 min read
MACOM expands PURE DRIVE: Introducing dual channel laser driver and TIA
MACOM Technology advances its MACOM PURE DRIVE portfolio with the introduction of new dual channel laser driver and transimpedance amplifier (TIA) products. Designed as an alternative to Digital Signal Processor (DSP) based architectures for pluggable optical modules, MACOM PURE DRIVE solutions offe
2 min read
Semiconductor industry's first: PHY SoC for 5GNR/LTE small cell Open RAN radio
5G open RAN baseband semiconductor and software specialist Picocom launched semiconductor chip industry's first SoC optimised for 5G small cell Open RAN radio units (O-Rus). The PC805 small-footprint, low-power SoC supports flexible RF/bandwidth mapping and can be used for designing enterprise, in
5 min read
Jabil to acquire Intel’s pluggable Si-phtonics optical Tx module line
Jabil announced that it will be taking over the production and sale of Intel's current Silicon Photonics-based pluggable optical transceiver ("module") product lines, as well as the development of future generations of these modules. "This deal better positions Jabil to cater to the needs of our
2 min read
Wi-Fi 7 features and benefits: Enabler of AR/VR headset, wireless display, and cloud gaming
Latency is a big issue in wireless AR/VR headsets and also for future wireless displays. To support seamless real-time transmission of high-bandwidth extremely interactive video and graphics across devices, very small delays due to interferences and latency of the networks should be kept extremely
4 min read
Mitsubishi plays a key role in the 2023 IEC White Paper’s drafting
Mitsubishi Electric has spearheaded the development of the 2023 International Electrotechnical Commission (IEC) White Paper titled "Power Semiconductors for an Energy-Wise society". This new publication, released on October 17, marks the first instance of a White Paper issuing recommendations for th
5 min read
Broadcom launches most advanced 5nm single-chip 25.6Tb/s router
Broadcom takes the lead in developing most advanced single chip router by launching 5 nm chip named Qumran3D. Qumran3D can route the data at speeds of 25.6 Terabits per second in a fixed form factor, with Ethernet port rates from 100 Gb/s to 800 Gb/s. Qumran3D enables significant power saving u
7 min read
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