Photonic IC powered 6.4Tbps CPO with integrated laser for AI/ML application
Date: 31/03/2024
Ranovus said it has been collaborating with MediaTek to deliver a 6.4Tbps co-packaged optics solution for MediaTek’s next generation ASIC design platform.
MediaTek unveiled its next-generation custom ASIC design platform, integrating high-speed electrical and optical I/Os within the same ASIC implementation. This innovation offers enhanced flexibility and performance for high-performance computing, AI/ML, and data center networking applications.
Ranovus said its Odin CPO 3.0 reduces power consumption, footprint, and cost of the system by 50% compared to existing solutions. Ranovus single chip monolithic Electro-Photonic Integrated Circuit (EPIC) packs 100Gbps TIAs, Drivers, Silicon Photonics Modulaters and Photo detectors. Odin CPO 3.0 supports passive fiber and laser die attach on the EPIC die at scale. Ranovus Odin IP cores are designed for use in development of a new category of Application Specific Optical Engines (ASOE) for high capacity AI/ML workloads.
Heterogeneous Integration: MediaTek's platform combines in-house SerDes for electrical I/O with co-packaged Odin optical engines from Ranovus. This enables a serviceable socketed implementation featuring 8x800G electrical links and 8x800G optical links for flexible deployment options.
Performance and Efficiency: The CPO demonstration delivers reduced board space and device costs, high bandwidth density, and up to 50% lower system power consumption compared to existing solutions. Ranovus' Odin optical engine offers flexibility with internal or external laser optical modules to align with varied usage scenarios.
Complete Solution: MediaTek's ASIC design platform offers a comprehensive solution from design to production, incorporating die-to-die interfaces, advanced packaging, high-speed interfaces, and thermal and mechanical designs to meet diverse customer needs.
Understanding Co-Packaged Optics (CPO): Co-packaged optics technology integrates chips and optical components into the same package, enhancing efficiency, compactness, and reliability in optical transmission. Traditional optical module packaging involves separate chip and component packaging connected through cables, leading to space constraints and reduced transmission efficiency. CPO overcomes these limitations by integrating components within the same package, improving bandwidth, latency, energy efficiency, and signal reach.
Industry Trends: The CPO market is witnessing rapid growth, with revenue expected to reach US$2.6 billion by 2033, driven by a 46% CAGR. As data transmission demands increase, architecture designers are integrating optics closer to the chipset to improve transmission efficiency and reliability. Silicon photonics technology plays a crucial role, leveraging semiconductor fabrication techniques to create photonic integrated circuits on silicon wafers, enhancing bandwidth, latency, energy efficiency, and signal reach within data centers.
MediaTek demonstrated its new co-packaged optics solution for the AI/ML and HPC markets together with Ranovus at OFC 2024 at Booth 5744 in San Diego, March 26-28.
