Photonic IC powered 6.4Tbps CPO with integrated laser for AI/ML application

Ranovus said it has been collaborating with MediaTek to deliver a 6.4Tbps co-packaged optics solution for MediaTek’s next generation ASIC design platform. MediaTek unveiled its next-generation custom ASIC design platform, integrating high-speed electrical and optical I/Os within the same ASIC implementation. This innovation offers enhanced flexibility and performance for high-performance computing, AI/ML, and data center networking applications. Ranovus said its Odin CPO 3.0 reduces power consumption, footprint, and cost of the system by 50% compared to existing solutions. Ranovus single chip monolithic Electro-Photonic Integrated Circuit (EPIC) packs 100Gbps TIAs, Drivers, Silicon Photonics Modulaters and Photo detectors. Odin CPO 3.0 supports passive fiber and laser die attach on the EPIC die at scale. Ranovus Odin IP cores are designed for use in development of a new category of Application Specific Optical Engines (ASOE) for high capacity AI/ML workloads. Heterogeneous Integration: MediaTek's platform combines in-house SerDes for electrical I/O with co-packaged Odin optical engines from Ranovus. This enables a serviceable socketed implementation featuring 8x800G electrical links and 8x800G optical links for flexible deployment options. Performance and Efficiency: The CPO demonstration delivers reduced board space and device costs, high bandwidth density, an...