AI
Analog Devices Agrees to Acquire Empower Semiconductor for $1.5 Billion in All-Cash Deal
After some news channels reported the story of Analog Devices acquiring Empower Semiconductor few days back, Analog Devices has officially confirmed it has reached a definitive agreement under which Analog Devices will acquire Empower in an all-cash transaction valued at $1.5 billion. The
4 min read
SEMIFIVE and ICY Tech Announce Successful Tape-Out of 8nm eMRAM-Based Edge AI SoC
SEMIFIVE and ICY Tech, a Chinese AI semiconductor company have completed the tape-out of a next-generation Edge AI SoC developed using Samsung Foundry’s 8nm (8LPU) embedded Magnetic Random Access Memory (eMRAM) technology. The project targets the first commercial deployment of 8nm eMRAM tec
4 min read
Beyond NVIDIA’s GPU Rat Race: Tenstorrent’s Generalized, Open-Source, High-Performance AI Era
Are you locked yourself to GPUs from Nvidia and AMD! Turnaround and look at Tenstorrent. It has something better to offer in many angles for AI computing. RISC V based AI Chip Expert Tenstorrent Showcases Galaxy Supercluster and New Developer Hardware at its recent event TT-Deploy. At the T
6 min read
Pixxel and Sarvam to Develop India’s First Orbital Data Centre Satellite Pathfinder for Q4 2026 Launch
Pixxel, a planetary intelligence company that builds and operates advanced imaging satellites, has announced a strategic partnership with Sarvam to develop and build India’s first orbital data centre satellite. Pixxel will design, build, launch, and operate the Pathfinder satellite, while S
3 min read
Rambus Announces SOCAMM2 LPDDR5X Server Module Chipset for AI Data Centers Supporting Up to 9.6 Gb/s
Rambus announced a SOCAMM2 (Small Outline Compression Attached Memory Module) chipset designed to enable low-power, high-performance LPDDR5X-based memory modules for AI server platforms. The SOCAMM2 chipset is the first in a planned family of LPDDR-based server module chipsets for future AI
4 min read
Semidynamics Secures SK hynix Investment to Advance Memory-Centric AI Inference Chips Following 3nm Tape-Out
Semidynamics, a company developing memory-centric AI infrastructure for large-scale inference, announced a strategic investment from SK hynix, a memory manufacturer. The investment is based on the shared view that memory architecture determines the economics of next-generation AI inference, measu
9 min read
Mitsubishi Electric Invests in Sakana AI for AI Foundation Model Solutions
Mitsubishi Electric Corporation announced that it has invested in Sakana AI Inc., a Japan-based AI startup focused on developing next-generation AI foundation models. The investment aims to create new solutions and expand businesses related to Mitsubishi Electric’s Serendie digital pl
3 min read
Arm Expands Compute Platform to Production Silicon with First Data Center CPU for Agentic AI
Arm announced that it is extending its compute platform to include production silicon products for the first time in the company's history. The expansion adds Arm-designed silicon alongside existing IP and Arm Compute Subsystems (CSS), providing partners with options across all three categories
4 min read
Kandou AI Closes Oversubscribed $225 Million Series A Round to Address AI Memory and Interconnect Bottlenecks
Kandou AI, a company focused on high-speed, energy-efficient connectivity and system solutions for artificial intelligence infrastructure, announced the closing of a $225 million strategic funding round. The oversubscribed Series A was led by Maverick Silicon, with strategic participation from So
4 min read
Samsung and AMD Sign MOU for HBM4 Supply to Next-Generation Instinct MI455X GPU and DDR5 for EPYC Processors
Samsung Electronics and Advanced Micro Devices (AMD) signed a Memorandum of Understanding (MOU) on March 18, 2026, to expand their collaboration on AI memory and computing technologies. The signing took place at Samsung’s chip manufacturing complex in Pyeongtaek, South Korea, with AMD Chair
2 min read
STMicroelectronics Expands 800 VDC Power Conversion Portfolio for AI Datacenters with 12V and 6V Architectures at NVIDIA GTC 2026
STMicroelectronics announced the addition of 800 VDC to 12V and 800 VDC to 6V power conversion architectures to its 800 VDC portfolio, developed in alignment with the NVIDIA 800 VDC reference design. These new stages complement the previously introduced 800 VDC to 50V solution, providing a comple
3 min read
NVIDIA Vera Rubin Platform Enters Production with Seven-Chip AI Infrastructure for Agentic Workloads at GTC 2026
NVIDIA announced at the GTC 2026 conference in San Jose on March 16 the Vera Rubin platform, with seven new chips now in full production. The platform provides configurable AI infrastructure optimized for pretraining, post-training, test-time scaling, and agentic inference phases. The Vera R
7 min read
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