STMicroelectronics announced the addition of 800 VDC to 12V and 800 VDC to 6V power conversion architectures to its 800 VDC portfolio, developed in alignment with the NVIDIA 800 VDC reference design. These new stages complement the previously introduced 800 VDC to 50V solution, providing a complete set of options for 800 VDC power distribution in gigawatt-scale AI compute infrastructure.
The solutions were highlighted during NVIDIA GTC 2026. The 800 VDC architecture supports higher energy efficiency, reduced power losses, and scalable high-compute-density infrastructure for hyperscalers and AI workloads.The expansion addresses varying server form factors, GPU generations, rack densities, thermal envelopes, and cooling strategies in large-scale training clusters, inference farms, a nd high-density AI systems. The 50V, 12V, and 6V intermediate DC buses are expected to coexist depending on specific configurations.
The 800 VDC to 12V converter enables direct high-efficiency distribution from rack-level power shelves to voltage domains feeding advanced AI accelerators. It eliminates the traditional 54V intermediate stage, reduces conversion steps and system-level losses, lowers copper usage, and simplifies integration for future GPU generations. It includes a newly developed high-density power delivery board (PDB) that achieves efficiency exceeding the combined performance of previous two-stage conversion paths.
The 800 VDC to 6V architecture positions the conversion stage closer to the GPU, reducing the number of conversion stages, minimizing resistive losses and IR drop, improving transient performance under fast load changes, and decreasing copper usage. It targets servers with ultra-dense GPU configurations.
In October 2025, STMicroelectronics introduced a prototype power-delivery system featuring a compact GaN-based LLC converter operating directly from 800 V at 1 MHz, achieving over 98% efficiency and power density exceeding 2,600 W/in³ at 50 V output in a smartphone-sized footprint.
The three solutions integrate ST’s technologies in power semiconductors (silicon, SiC, GaN), analog and mixed-signal devices, and microcontrollers, with custom design at chip and package levels.
Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office, stated that the new converters support deployment of gigawatt-scale compute infrastructure with more efficient, scalable, and sustainable power architectures as AI infrastructure continues to expand.
Additional technical information is available at https://blog.st.com/800-v-hvdc-data-center/.
