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SEMI ESD Alliance 2026 Executive Outlook to Examine Agentic AI Impact on Chip Design and Verification

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The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, has announced its annual Executive Outlook event focused on semiconductor EDA, agentic AI, and IP company executives.

The event is scheduled for Wednesday, June 10, 2026, at Cadence Design Systems’ headquarters in San Jose, California. It will begin at 5:30 p.m. with networking and dinner, followed by a panel discussion at 6:30 p.m. Registration is open.

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The theme of this year’s panel is “How Will Agentic AI Change Chip Design and Verification?” The discussion will cover changes in chip design and verification as agentic AI tools become more mainstream. It will address early implementation successes of agentic AI tools and applications, as well as collaboration between established EDA companies and agentic AI startups.

The panel will be moderated by Ed Sperling, Editor in Chief of Semiconductor Engineering. Panelists include:

- Dave Kelf, CEO of Breker Verification Systems
- Cindy Cui, VP of Global Customer Success at ChipAgents
- Shelly Henry, CEO of Moores LabAI
- Ann Wu, CEO at Silimate
- Vince Wong, Head of AI Development at Verific Design Automation

Tickets for the event are free for SEMI/ESDA members and $40 per person for non-members. Additional information is available on the event page.

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The Electronic System Design Alliance serves as the central voice for the semiconductor design ecosystem and addresses technical, marketing, economic, and legislative issues affecting the industry.


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