Nordson Electronics Solutions announced its participation in SEMICON China 2026 where it will demonstrate its automated fluid dispensing and plasma treatment systems for wafer-level and panel-level packaging at booth 3601 (Hall N2), Shanghai New International Expo Centre, March 25-27, 2026.
The ASYMTEK Vantage fluid dispensing system will be featured for applications including precise fine lines for underfill, gap fill, sealing lines in fan-out/fan-in processes, strips, and module assembly. A new cleanroom configuration for the Vantage system, designed to meet Class-100 standards for advanced packaging operations requiring cleanroom compatibility, will be previewed at the booth.
The MARCH FlexTRAK plasma system in stand-alone configuration will also be exhibited. This system provides high-throughput surface treatment in a compact footprint for semiconductor component processing. It supports flexible plasma chamber configurations for contamination removal, etching, and surface activation prior to die attach, wire bond, molding, encapsulation, and underfill.
Productronica China will run concurrently March 25-27, 2026, at the same Shanghai exhibition center. Nordson Electronics Solutions will participate in the Electronic Intelligent Manufacturing Forum technical conference, where Kahn Huang, application manager for Nordson Electronics Solutions China, will present on “Nordson Empowers AI Smart Factories and Effectively Improves Process Reliability.”
Partners will exhibit Nordson equipment in Hall E4 at Productronica China: AMT will show the ASYMTEK Spectrum II S2-900 Precision Fluid Dispensing System at booth 4240, and Ecelent will display the ASYMTEK Vantage] fluid dispensing system, ASYMTEK Select Coat SL-1040 Conformal Coating system, and MARCH FlexTrack-CD at booth 4590.
