Rapidus Corporation, a Japanese semiconductor manufacturer, is making strides to compete with other leading edge foundries such as TSMC and Samsung and Intel in the advanced logic chip market. Rapidus has initiated prototyping of its 2nm gate-all-around (GAA) transistor structure at its Innovative Integration for Manufacturing (IIM-1) foundry. The prototype wafers have begun demonstrating electrical characteristics, marking a key step in the company’s development timeline.
The IIM-1 foundry employs fully single-wafer front-end processing, allowing adjustments to individual wafers to optimize production. This process captures extensive data to train AI models, improving wafer yields. Rapidus is among the first to commercialize this approach through its Rapid and Unified Manufacturing Service (RUMs).
The foundry also utilizes extreme ultraviolet (EUV) lithography, essential for forming 2nm GAA structures. Rapidus became the first company in Japan to install advanced EUV machinery, completing EUV exposure in April 2025, three months after equipment delivery in December 2024.
Since breaking ground in September 2023, Rapidus has met significant milestones, including clean room completion in 2024 and the installation of over 200 advanced semiconductor equipment pieces by June 2025. The company is developing a Process Development Kit for the 2nm process, set for release to select customers by Q1 2026, enabling them to begin their own prototyping. Rapidus plans to start mass production in 2027.
Rapidus’ innovative manufacturing and chiplet packaging solutions position it as a potential alternative, addressing global demand for diversified chip supply chains.
Backed by the Japanese government and eight major firms, including Sony and Toyota, Rapidus has secured over ¥920 billion in subsidies. Collaborations with IBM and IMEC bolster its 2nm technology development, targeting high-performance, low-power chips for AI applications.
