Ansys announced that its thermal and multiphysics signoff tools have been certified for designs manufactured with Intel's 18A process technology. This certification ensures the functionality and reliability of advanced semiconductor systems for demanding applications, including AI chips, GPUs, and high-performance computing products. 
Figure: 3D simulation of an interposer connecting the High Bandwidth Memory module to the die in Ansys HFSS IC
Certified Tools: Ansys RedHawk-SC and Ansys Totem power integrity signoff platforms, along with Ansys HFSS-IC Pro electromagnetic simulation software, are now certified for Intel's 18A transistor process technology.
Comprehensive Signoff Flow: Ansys and Intel Foundry have developed a thermal and multiphysics signoff flow for Intel Foundry's Embedded Multi-Die Interconnect Bridge technology. This includes the Ansys RedHawk-SC Electrothermal signoff platform and Ansys SIwave package electromagnetics simulation software.
Intel Foundry Chiplet Alliance: Ansys has joined the Intel Foundry Chiplet Alliance to foster an interoperable and secure ecosystem for designing multi-die heterogeneous systems.
Future Collaboration: Ansys is progressing certification for Intel 18A-P and collaborating on enablement for Intel 14A-E.
Ansys' RedHawk-SC and Totem platforms deliver speed, accuracy, and capacity to analyze the power integrity and reliability of Intel 18A RibbonFET Gate-all-around (GAA) transistors with PowerVia backside power delivery. The new HFSS-IC Pro, part of the HFSS-IC product family, is certified for modeling on-chip electromagnetic integrity in radio frequency chips, WiFi, 5G/6G, and other telecommunication applications made with the Intel 18A process node.
EMIB technology facilitates 3D-IC for high-performance microprocessors and heterogeneous integrated systems, enhancing the performance and integration of advanced computing systems. The signoff flow includes thermal reliability analysis with RedHawk-SC Electrothermal. Ansys and Intel Foundry are extending their collaboration to cover next-generation EMIB-T technology, which will add through-silicon vias to EMIB. The EMIB-T flow includes HFSS-IC Pro and SIwave for signal integrity analysis and RedHawk-SC and Totem for power integrity analysis.
"Our approach to multi-die assembly is changing the way the industry thinks about stacking chips and designing for efficiency," said Suk Lee, vice president & general manager, Ecosystem Technology Office at Intel Foundry. "Ansys tools are critical in this process because they help our mutual customers validate their designs with extreme accuracy — saving them costs that may not otherwise be recoverable. Furthermore, we are looking forward to Ansys' participation in the Intel Foundry Chiplet Alliance, which is critical to advancing chiplet technology."
"Ansys' suite of multiphysics simulation tools instill confidence in our customers, ensuring their semiconductor systems achieve the highest levels of thermal, signal, power, and mechanical integrity," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys.
