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Atomera and Leading Capital Equipment company partner to accelerate MST adoption for advanced node technologies

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Atomera announced a strategic marketing agreement with a global leader in chip fabrication technology. This partnership aims to fast-track the adoption of Atomera’s Mears Silicon Technology for next-generation technologies, including AI, 5G, and other advanced electronics.
 
Under this agreement, the two companies will collaborate to optimize the implementation of Atomera’s MST technology on the capital equipment provider’s state-of-the-art machinery. This joint effort addresses critical challenges in the semiconductor industry, providing more targeted and mature solutions that enable faster adoption and smoother integration into advanced node production processes. The collaboration focuses on delivering MST—a quantum-engineered advanced material that enhances yields, reduces chip sizes on wafers, lowers power consumption, and cuts production costs. Accelerating the market introduction of these solutions offers significant benefits to customers and the semiconductor industry as a whole.
 
“MST is recognized throughout the industry as a flexible, cost-effective solution for various market segments,” said Scott Bibaud, President and CEO of Atomera. “Through this collaboration, Atomera can leverage the capital equipment company’s extensive salesforce and strong relationships with chipmakers to accelerate time to production. Atomera’s material technology not only addresses some of the most difficult challenges faced by leading-edge customers but also drives demand for our partner’s capital equipment tools, creating a win-win-win situation.”
 
“The collaboration in materials and manufacturing equipment is critical to support rapid semiconductor innovation in the AI era. Leveraging Atomera’s MST on the equipment of an industry-leading semiconductor vendor will enable more efficient chips with minimal risk,” said Jim McGregor, Principal Analyst at TIRIAS Research. “While the collaboration will benefit everything from embedded/IoT to advanced server applications, the greatest advantage may be seen with the upcoming transition to Gate-All-Around transistors, also known as RibbonFET and Nanosheet transistors.”
 
For more information, please visit https://ir.atomera.com
 

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