Entegris has entered the silicon carbide (SiC) and diamond-enabled thermal management materials market for next-generation AI advanced packaging. The company has completed an acquisition, plans a manufacturing investment in Taiwan and has formed a long-term development partnership with Element Six.
Olivier Blachier, president, Materials Solution and SVP, chief innovation officer at Entegris, said growth in AI compute, from model training to inference, is intensifying power and heat-management demands in data centers.
Entegris has acquired Advanced Abrasives Corporation, a New Jersey-based producer of diamond-made precision super-abrasive consumables for hard-substrate polishing. The acquisition builds on Entegris' SiC CMP capabilities in slurries, pads, cleans and surface conditioning, as well as its materials science and surface engineering intellectual property. Following customer engagement, Entegris plans to add a manufacturing line in Taiwan for its SiC solutions while continuing U.S.-based exploratory research and development on next-generation thermal interface materials.
The partnership with Element Six, part of De Beers Group, is intended to accelerate integration of diamond-enabled thermal management solutions into advanced packaging. The work will focus on scalable, cost-effective wafer-level and heterogeneous integration approaches intended to reduce manufacturing complexity, minimize thermal boundary resistance and support next-generation logic and memory chips and their 3-D integration. Blachier said: “Our goal is to facilitate better heat dissipation without compromising performance or reliability.”
Entegris will present its advanced thermal management platform strategy at its Capital Markets Day on November 9, 2026, in New York.
