Wolfspeed, Inc. has commercially introduced its proprietary transparent silicon carbide (TSiC™) technology for next-generation augmented reality (AR), quantum computing and advanced optical applications.
Wolfspeed said its optical-grade TSiC™ substrates are engineered for exceptionally low optical absorption and superior wafer flatness. The company cited silicon carbide’s high refractive index, low birefringence, hardness and thermal conductivity as properties that make it a promising material for next-generation AR waveguides, supporting wider fields of view, improved image quality and more compact wearable devices.
In quantum computing, TSiC™ technology has the potential to host quantum bits (qubits), preserve their quantum states and transmit quantum information through light within a single silicon carbide crystal. The company said silicon carbide can support all these functions, unlike many alternative materials.
“Wolfspeed’s leadership in silicon carbide innovation extends well beyond traditional semiconductor applications,” said Katrin Feurle, vice president, Beyond Power at Wolfspeed. “Our proprietary TSiC™ technology and extensive intellectual property portfolio position us to help enable breakthroughs in augmented reality, quantum computing and other emerging markets, reinforcing the versatility and transformative potential of silicon carbide.”
Wolfspeed said the technology builds on more than 35 years of silicon carbide innovation, including its work in LED technology and experience manufacturing high-purity semi-insulating (HPSI) wafers. The company is advancing its 200 mm optical-grade substrates while developing 300 mm TSiC™ technology. More information about TSiC™ technology, including sample requests, is available from Wolfspeed.
