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VLSI

eInfochips Completes End-to-End Turnkey ASIC Design with Test Chip Bring-Up

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eInfochips, an Arrow Electronics company and provider of semiconductor and product engineering services, has demonstrated end-to-end turnkey ASIC design capability through the development, fabrication, packaging, and bring-up of a test chip.

The architecture of the test chip includes a built-in microcontroller for current and voltage monitoring, smart programmable control, diagnostics, and software configurability. Combining these functions into one device reduces component count and board complexity while improving monitoring, protection, and system-level control.

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“Customers developing custom silicon often need to coordinate across design, foundry, packaging, and manufacturing ecosystem. This accomplishment demonstrates our ability to take broader ownership of that journey, helping customers reduce handoffs, improve accountability, and move more efficiently from concept to working silicon,” said Sumit Sethi, Vice President and General Manager, Engineering Services, eInfochips.

eInfochips has supported automotive, industrial, and semiconductor programs for more than two decades. Its capabilities span architecture, IP development, analog and mixed-signal design, verification, DFT, physical design, sign-off, post-silicon engineering, and manufacturing ecosystem coordination.

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The demonstration shows eInfochips’ capacity as an engineering services provider to support customers across the complete custom silicon development lifecycle while adapting engineering expertise to customer-specific requirements.

Additional details on eInfochips’ turnkey chip design services are available at: https://www.einfochips.com/services/silicon-engineering/turnkey-chip-design/

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EEHerald News Desk

Editor, Electronics Engineering Herald


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