Tower Semiconductor will hold its 2026 Technical Global Symposium (TGS) on November 17, 2026, in Santa Clara, California. The event will bring together customers, partners, and industry leaders to explore technology and market trends shaping the evolution of AI infrastructure, high-performance computing, advanced connectivity, and intelligent sensing. Attendees will get the chance to engage directly with Tower's executive leadership, technology experts, and ecosystem partners.
This marks Tower's second Technical Global Symposium of the year, following a successful 2026 event held in Shenzhen, China, underscoring the company's commitment to deep global customer engagement, industry collaboration, and technology leadership across key semiconductor markets.
The event will include a keynote session from Tower's CEO, along with an executive industry panel featuring senior leaders from several major technology companies, including Oliver Sun, CTO of TeraHop; Hong Liu, VP and Fellow at Google AI; Julie Sheridan Eng, CTO of Coherent; and Andy Bechtolsheim, founder and chief architect at Arista.
The panel will examine how next-generation data center architectures are evolving and the technologies driving the rapid expansion of AI-driven infrastructure, with panelists sharing perspectives on the opportunities, challenges, and semiconductor innovations needed to support future computing and connectivity demands.
Technical sessions led by Tower executives will showcase the company's advanced process technologies, including its market-leading, high-volume silicon photonics (SiPho), SiGe, RF and RF SOI, power management, sensors, and display platforms, along with dedicated sessions on design enablement and aerospace and defense solutions. Participants will get insight into the latest technology developments, future platform roadmaps, and emerging applications shaping key high-growth markets.
