Quobly, a French company developing silicon-based quantum computers, and CEA-Leti, a research institute focused on microelectronics and information technology, are strengthening their long-standing collaboration by giving Quobly access to the FAMES Pilot Line. This complements Quobly's existing industrial partnership with STMicroelectronics and supports the company's broader technology roadmap.
FAMES is a pioneering initiative aimed at promoting semiconductor technology development in Europe by supporting higher-performance, more energy-efficient, and more sustainable chip designs. Through access to FAMES, Quobly can use advanced semiconductor equipment and process modules to develop and evaluate new manufacturing process flows and patterning approaches for future generations of its quantum processors.
Quobly was founded in 2022, building on more than 15 years of research conducted at CEA-Leti and CNRS in silicon spin-qubit technology, a qubit is the basic unit of quantum information, and a spin qubit stores that information in the quantum spin state of an electron. In 2016, CEA-Leti and its research partners demonstrated a silicon spin qubit built using an industrial CMOS manufacturing process based on FD-SOI technology on a 300mm wafer. Since Quobly's founding, the company and CEA-Leti have continued collaborating on silicon spin-qubit technology and the underlying technical building blocks behind Quobly's QSOI architecture, which combines silicon spin qubits with an FD-SOI semiconductor platform. That architecture is currently being industrialized in partnership with STMicroelectronics, using its 300mm manufacturing infrastructure.
This ongoing collaboration supports development of key technology building blocks needed to integrate, control, and scale silicon spin qubits, as Quobly works toward increasingly scalable quantum processor designs.
Nicolas Daval, chief engineering officer of Quobly, said the company was founded on more than 15 years of research at CEA-Leti and CNRS focused on developing silicon spin-qubit technology. He said the collaboration with CEA-Leti has continued since Quobly's founding, while its partnership with STMicroelectronics is enabling it to industrialize QSOI on 300mm semiconductor manufacturing infrastructure. He said access to FAMES adds another capability to this broader ecosystem, letting Quobly explore and mature technology options for the next generations of its quantum processors.
As a user of the FAMES Pilot Line, Quobly gains access to advanced semiconductor manufacturing equipment and process modules to explore and mature new technology options for future processor generations. In particular, FAMES provides an environment for developing and testing innovative process flows and patterning approaches, complementing the industrial manufacturing roadmap Quobly is pursuing with STMicroelectronics.
Jean-Rene Lequepeys, chief technology officer of CEA-Leti, said the collaboration with Quobly builds on a long-running research effort in silicon quantum technology, continuing to connect advanced semiconductor process development with the requirements of quantum computing. He said FAMES gives Quobly access to state-of-the-art process capabilities to investigate new technology options and support development of future generations of silicon quantum processors.
By combining CEA-Leti's semiconductor research and process development capabilities with Quobly's expertise in silicon spin qubits and its industrial partnerships, the collaboration contributes to the continued development of technology needed to scale silicon quantum processors.
Quobly plans to commercialize its first quantum computer, called Alloy Pioneer, by the end of 2026, with a roadmap extending toward large-scale, fault-tolerant quantum architectures targeting one million qubits by 2032.
CEA-Leti and Quobly Expand Collaboration on Silicon Quantum Technologies
Listen to this story
ⓘ AI NARRATED0:00 / 0:00
More from Advanced Semiconductor →

Anderon, IBM's Quantum Wafer Foundry, Secures $1 Billion CHIPS Award
Anderon LLC, an IBM company, has finalized a $1 billion award under the CHIPS and Science Act with the U.S.…
AI and automation in agriculture highlighted at Arkansas-Japan SmartAg Summit
IEEE-USA and the IEEE Japan Office are hosting a new summit aimed…

Kyocera and Tohoku University integrate optical isolators into silicon photonics chips
Kyocera Corporation and the Research Institute of Electrical Communication (RIEC) at Tohoku…


