VisionPower Semiconductor Manufacturing Company Pte. Ltd. (VSMC), the joint venture established in September 2024 by Vanguard International Semiconductor Corporation and NXP Semiconductors N.V. marked the grand opening of its first 12-inch (300mm) fab in Tampines, Singapore.
The opening ceremony was attended by Dr. Tan See Leng, Singapore's Minister for Trade and Industry (Energy and Industry); Mr. Png Cheong Boon, Chairman of the Singapore Economic Development Board (EDB); and Ms. Jacqueline Poh, Chief Executive Officer of JTC Corporation. Representatives from TSMC and other partners, along with customers, suppliers, industry associations, and government agencies were also present, together with management teams from VSMC, VIS, and NXP.
With construction complete, the fab has entered the risk production stage. Volume production is scheduled to begin in the first quarter of 2027. VSMC held a groundbreaking ceremony in December 2024. After 22 months of construction, the fab processed its first sample lot with yields above 99% and remains on track for the planned start of volume production.
The fab will support process technologies ranging from 130nm to 40nm for mixed-signal, power management, analog, and interposer applications serving the high-performance computing (HPC), mobile, automotive, industrial, and consumer end markets. It adopts a fully automated smart manufacturing model that integrates artificial intelligence and digital management technologies.
At full capacity by 2029, the fab is expected to produce approximately 44,000 12-inch wafers per month and create around 1,600 jobs.
Leuh Fang, VSMC and VIS Chairman, said: “Today's opening ceremony marks a significant milestone for VSMC and reflects VIS' long-term commitment to deepening its presence in Singapore while expanding its global footprint. Since establishing the joint venture in 2024, we have worked closely with NXP Semiconductors and our partners to complete construction of our first 12-inch fab. With the fab now officially operational, we will be better positioned to meet our customers' growing demand for specialty IC manufacturing, further strengthen the resilience of the global semiconductor supply chain, and contribute to the continued growth of Singapore's high-tech industry and semiconductor ecosystem.”
Rafael Sotomayor, President and Chief Executive Officer of NXP Semiconductors, said: “The VSMC joint venture fab marks an important milestone in further strengthening NXP’s manufacturing base and assurance to support long-term customer demand. Building on decades of operations and investment in Singapore, VSMC enhances our geographic resilience, supply control, and cost competitiveness, while advancing our differentiated hybrid manufacturing strategy. Our planned manufacturing capacity at VSMC remains unchanged, helping us drive sustainable growth and deliver the innovative technologies that are enabling the next generation of intelligent edge and Physical AI systems.”
Ms. Cindy Koh, Executive Vice President, Singapore Economic Development Board (EDB), said: “VSMC’s fab reflects the strong confidence that global companies continue to place in Singapore as a global node for advanced manufacturing and semiconductor value chain. Beyond adding new capabilities and capacity to Singapore’s semiconductor ecosystem, VSMC’s collaborations with our institutes of higher learning will equip our local workforce to contribute to technologies that shape industries and trends. VSMC’s efforts across carbon abatement, energy efficiency and water recycling reflects its ongoing commitment to more sustainable manufacturing practices in Singapore.”
The fab was designed and constructed in accordance with LEED (Leadership in Energy and Environmental Design) and Singapore's Green Mark standards. It incorporates renewable energy solutions and green manufacturing practices. VSMC has signed memoranda of understanding (MOUs) with leading universities in Singapore and is running internship and professional training programs.
