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Qnity Deepens Advanced Packaging Roadmap Through New Research Partnership

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Qnity Electronics has announced it's accelerating investment in next-generation semiconductor technologies by gaining access to a broader portfolio of research programs.
 
The move responds to a broader shift happening in chip design: as AI workloads, high-performance computing, and other data-intensive applications demand more performance and efficiency, chipmakers are increasingly turning to chiplets (smaller, specialized chips combined into a single package), high-bandwidth memory, wafer-level packaging, 3D stacking, and heterogeneous integration, meaning combining different types of chips built with different manufacturing processes into one package. Together, these approaches represent a shift away from traditional flat, two-dimensional chip designs toward more complex, vertically stacked architectures. Qnity says it's investing ahead of this shift with a platform that spans the full advanced packaging process, from front-end work through back-end assembly, including materials used for patterning, planarization (smoothing chip surfaces), metallization and interconnects (the wiring that links components together), advanced packaging solutions, and thermal management.
 
As part of this push, Qnity has partnered with imec, a leading global research center focused on advanced semiconductor technology. By joining imec's research program, Qnity gains deeper access to imec's broad portfolio of ongoing research, its advanced infrastructure and technical experts, and its wider network of industry and academic partners worldwide. Qnity frames this partnership as aligned with its longer-term innovation strategy aimed at enabling the next major leap in computing performance, and says it strengthens the company's ability to co-develop next-generation materials alongside other leading technology companies.
 
Randy King, chief technology officer at Qnity, said the company is investing in the direction the industry is headed next, noting that as computing moves toward smaller, more densely stacked designs, advanced packaging is becoming one of the most critical areas for improving performance, efficiency, and scale. He said the collaboration with imec gives Qnity deeper access to the ecosystem, infrastructure, expertise, and partnerships needed to help shape that future, and to bring next-generation materials innovation to its customers.
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EEHerald News Desk

Editor, Electronics Engineering Herald


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