Andes Technology Corporation, a provider of high-efficiency, low-power 32/64-bit RISC-V processor cores and a Founding Premier Member of RISC-V International, announced that global cumulative shipments of customer SoCs powered by its Andes CPU IP have exceeded 20 billion units. The milestone was reached in the second quarter of 2026, up from 14 billion units reported in late 2023.
“Surpassing 20 billion units is a definitive validation of Andes’ commercial scale and execution,” said Frankwell Lin, Chairman and CEO of Andes Technology. “The velocity at which our customers scaled production from 14 billion to over 20 billion units signals that open-standard computing has reached absolute mass market adoption. As a pure-play CPU IP vendor, this footprint reflects the profound trust global tier-1 chip designers place in the robustness, quality, and mass-production readiness of AndesCore CPU IP.”
The growth is linked to Andes’ alignment with artificial intelligence applications alongside other mass-market segments. The company’s processor IP powers Meta’s Training and Inference Accelerator (MTIA) for recommendation systems and d-Matrix’s Raptor chiplet-based 3D In-Memory Compute accelerator for datacenter AI inference. It is also used in Phison’s SSDs and Allwinner’s Linux-driven camera SoCs.
“Our roadmap is explicitly engineered to address the market’s most complex, data-heavy challenges,” said Dr. Charlie Su, President and CTO of Andes Technology. “Whether it is deploying our high-performance vector processors like the AX46MPV for data centers, accelerating mathematical computation via Andes Automated Custom Extensions (ACE), or fulfilling strict safety compliance requirements for advanced automotive systems, the 20 billion milestone proves that our processor design, IP implementation and software support deliver the bulletproof reliability required for massive, world-class silicon rollouts. Our RISC-V market leadership helped us to achieve such success.”
The company stated that this shipment volume positions it for developments in spatial computing, AI agents, edge devices, and advanced automotive electronics.
