Panasonic Connect Launches FPX107CG/FP Driver Mounting System for Medium-Sized OLED Panels
The system is designed to support the growing adoption of OLED panels in IT devices such as notebook PCs and tablets, as well as automotive applications, where higher image quality, thinner, and lighter designs are required. It addresses production challenges associated with materials that have higher coefficients of thermal expansion than those used in LCD panels.
Key features of the FPX107CG/FP system include:
- Compatibility with panel sizes from 7 to 26 inches.
- Support for four mounting configurations COG, FOG, FOP, and COP by switching the component supply unit.
- Modular configuration separating ACF lamination, temporary bonding, and final bonding processes for flexible system design.
- Capability for both forward flow (left-to-right) and reverse flow (right-to-left) line configurations.
- Main bonding accuracy of ±3 μm (3σ) with Cpk 1.33 for IC/TCP mounting, compared to ±5 μm (3σ) in the previous FPX105CG model.
The system combines high-precision mounting technology with configurations optimized for mass production, supporting diverse customer requirements in medium-sized OLED panel manufacturing.
Panasonic Connect Group developed the FPX107CG/FP to meet demands for higher mounting precision and flexibility in multi-product, multi-mount production environments.
