SK hynix announced the launch of the iHBM solution that embeds integrated cooling elements (ICEs) within the high-bandwidth memory (HBM) package for next-generation HBM products. ICEs are cooling elements made of electrically non-conductive, thermally conductive silicon-based material designed to dissipate heat from the HBM package by providing an additional thermal path.
The solution addresses heat management challenges in HBM technology as stacking and speeds increase to meet AI data processing demand. Efficient management of power density in the Die-to-Die Physical Layer (D2D PHY), the interface connecting HBM and GPU, is a key factor for next-generation HBM competitiveness.
Existing HBM products use indirect cooling through the core die. The iHBM solution places ICEs directly in the D2D PHY area, where heat concentration is highest, creating an additional heat dissipation path. This reduces thermal resistance by 30% and enables stable chip operation in high-temperature and high-pressure conditions.
The iHBM solution uses SK hynix’s Wafer Level Packaging (WLP) process based on market-proven Mass Reflow Molded Underfill (MR-MUF) technology. This enables stable high-volume production and offers high design compatibility with existing System-in-Package (SiP) architectures, allowing adoption with minimal design adjustments.
The solution is slated for deployment in next-generation HBM products, including HBM5. It is intended to support stability and operational efficiency of high-performance computing (HPC) systems and AI data centers in high-density and high-bandwidth environments.
“iHBM is an optimal solution for thermal management, combining our memory design capabilities with advanced packaging technology,” said Kangwook Lee, Senior Vice President and Head of PKG Development at SK hynix. “The company will cement its AI memory leadership by taking preemptive steps to offer values needed in the AI environment for its customers.”
