Tokyo Electron has recently released two new 300mm wafer processing systems: the CLEAN TRACK LITHIUS Pro DICE, a coater/developer, and the EVAROS, a batch thermal processing system.
The CLEAN TRACK LITHIUS Pro DICE builds on the LITHIUS Pro Z model, which has supported advanced semiconductor mass production for over a decade. It incorporates defect control technology that reduces wafer defects from flawed resist coating by 50% or more compared to previous models, based on TEL estimates. The system achieves the fastest coating and development speeds in the industry and improves productivity and environmental performance by 25% or more through better cleanroom footprint utilization, throughput, and reduced utility exhaust volume, according to TEL comparisons. Enhanced data collection and processing improve system availability and engineer efficiency. It supports production of logic, DRAM, and NAND devices, including high-NA EUV and DUV processes.
Yasuhiro Washio, Vice President & General Manager of CTSPS BU at TEL, stated that LITHIUS Pro DICE offers world-class productivity and defect control suitable for a range of applications, including high-NA EUV and DUV. TEL plans to continue advancing technologies and expanding process modules to support semiconductor device evolution.
The EVAROS is a next-generation batch thermal processing system designed for complex 3D-structured devices, addressing needs for precise control, power-saving performance, and production efficiency. It processes up to 200 wafers per batch, exceeding previous 300mm models' capacity, with improved wafer transfer speeds for higher productivity. A new multi-zone control heater provides enhanced dynamic fidelity, response, stability, excellent heating uniformity, and reduced ramp-up, ramp-down, and stabilization times. Large-diameter exhaust ducts deliver high conductance for precise deposition control in ALD and other processes used in advanced devices.
The system reduces utility consumption (electricity, cooling water, gas), resulting in approximately 25% fewer CO2 emissions per wafer compared to the previous TELINDY PLUS, per TEL estimates. Features include automatic wafer carrier position adjustment for faster installation and maintenance, and a new system controller that will support future autonomous functions.
Shigeki Nakatani, Vice President & General Manager of TFF BU at TEL, described EVAROS as a major evolution in batch thermal processing, providing superior productivity and environmental performance for ALD and deposition processes requiring precise control. TEL intends to advance technologies and expand applications to meet customer needs.
