SemiQ said it will present its QSiC Gen3 line of SiC power modules at the Applied Power Electronics Conference (APEC) 2026, held March 22–26 at the Henry B. Gonzalez Convention Center in San Antonio, Texas.
The modules, on display at Booth #1451, target active front ends (AFE) and high-performance compressor units in datacenter cooling systems. They address power and thermal requirements in AI-driven datacenters, high-power industrial systems, and electric vehicle (EV) applications.
The QSiC Gen3 modules show a 30% reduction in specific on-resistance (R_ONsp) and turn-off energy losses (E_OFF) compared to prior generations. This lowers cooling complexity and switching losses in EV charging stations, energy storage systems, and industrial motor drives.
The displayed products include:
- S3 half-bridge modules: A 608 A module with 2.4 mΩ R_DS(on) and junction-to-case thermal resistance (R_θJC) of 0.07°C/W.
- SOT-227 modules: Five variants with R_DS(on) values of 7.4 mΩ, 14.5 mΩ, and 34 mΩ, suited for server power supplies, battery chargers, and PV inverters.
- B2T1 six-pack modules: R_DS(on) range of 19.5 mΩ to 82 mΩ, intended to reduce parasitics in motor drives and advanced AC-DC converters.
- B3 full-bridge modules: Up to 120 A with R_DS(on) as low as 8.6 mΩ, for high-voltage DC-DC systems with increased power density.
All modules operate at 1200V.
Dr. Timothy Han, President of SemiQ, stated: “These SiC technologies directly address the challenges faced by those implementing AI infrastructure. By improving efficiency, and addressing the escalating power demands of datacenters across key application areas, we are expanding the potential for AI to scale sustainably.”
Further details are available at semiq.com.
