Alphawave Semi introduces cutting-edge AI platform IP for ultra-fast, low-latency data center networks

Scaling connectivity efficiently to support the growth of AI clusters requires high-speed, low-latency interconnects to handle the massive data throughput demanded by AI applications. Alphawave Semi’s expertise in multiple technologies is essential for future AI developments.

 

Alphawave Semi offers customized silicon solutions optimized for diverse workloads across 64G UCIe, 224G SerDes, 800G/1.6T UALink, and 800G/1.6T UEC controllers. These solutions are available as IP subsystems or tailored, silicon-proven chiplets to address all aspects of connectivity in the data center. The company has also introduced a portfolio of PAM4 and Coherent-lite DSPs over optical and electrical connections for server-to-server and data center-to-data center interconnects.

New architectures and fabrics achieving high density and performance are being realized through the highest speed SerDes on advanced process nodes. Efficient die-to-die technologies, such as UCIe, deliver chip-to-chip connectivity not only on the same package but also for heterogeneous integration across the entire data center.

These hyper-optimized scale-up networks will link up to 1,000 GPUs to act like a single giant GPU. Multiple scale-up networks will then be connected and orchestrated over a dedicated scale-out network channel for low latency, low power, and low collisions.

“Through our unique DSP-based SerDes, manufactured using TSMC’s most advanced process nodes, our AI platform can deliver the performance required at the low-power levels needed via passive copper and low-power optical connectivity. This includes bringing optics to the XPUs and leveraging the low power, high-efficiency benefits of UCIe die-to-die connectivity (below 1pJ/bit) while capturing the long reaches of optics,” said Mohit Gupta, Senior VP & GM, Custom Silicon & IP, Alphawave Semi. “Our portfolio of silicon IP subsystems are set to be the building blocks of the custom silicon and chiplets that make up AI platforms,” continued Mohit Gupta.

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