STMicroelectronics has made available of its new STM32MP23 general-purpose microprocessors. These advanced MPUs are designed to deliver superior performance and ruggedness for industrial and Internet-of-Things edge compute, advanced Human-Machine Interface, and machine-learning applications.
High-Temperature Operation: The STM32MP23 MPUs can operate at temperatures up to 125°C, making them ideal for harsh industrial environments.
Dual Arm Cortex-A35 Cores: With dual 1.5GHz Arm Cortex-A35 cores, these MPUs offer high-speed processing and efficiency.
Real-Time Applications: A 400MHz Cortex-M33 core is included for real-time applications, ensuring responsive performance.
Neural Network Accelerator: The integrated neural network accelerator delivers 0.6 TOPS performance, enabling AI and machine-learning capabilities.
Advanced Graphics and Video: The MPUs feature a 3D graphics processor, H.264 decoder supporting up to 1080p60 video resolution, and a MIPI CSI-2 camera interface with raw data support.
Connectivity: Dual Gigabit Ethernet ports with time-sensitive networking and two CAN-FD interfaces ensure robust connectivity.
Security: The STM32MP23 series targets SESIP3 and PSA Level 3 certifications, with features like secure boot, Arm TrustZone architecture, secure key storage, and tamper detection.
Coinciding with the release of the STM32MP23 series, STMicroelectronics is extending support for each release of the OpenSTLinux distribution from two years to five years. This enhanced support ensures stability for customers throughout development and extends access to the latest security patches, easing compliance with the EU Cyber Resilience Act . ST’s commitment to mainlining OpenSTLinux allows developers to work comfortably with popular frameworks including Yocto, Buildroot, OpenWRT, and OpenSTDroid, accelerating time to market.
Developers can start evaluating the STM32MP23x using the STM32MP257 discovery kit, coupled with the dedicated STM32 MPU embedded software.
The STM32MP23 series MPUs are available in three BGA package options, offering the choice of high-density 0.5mm interconnect pitch or 0.8mm pitch for simplified 4-layer PCBs with plated-through holes. All packages are pin-to-pin compatible with STM32MP25 MPUs and operate over the industrial temperature range from -40°C to 125°C maximum junction temperature.
