Siemens announced delivering of certified Xpedition Package Designer automated workflow driven by Innovator3D IC for TSMC 3DFabric technologies.
“Siemens is pleased that our continued collaboration with TSMC has delivered a certified Xpedition Package Designer automated workflow driven by Innovator3D IC that provide customers with an expanding number of design avenues, even as time and design complexity pressures continue to rise,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “The combination of Siemens’ industry-leading Innovator3D IC driven semiconductor packaging solutions and TSMC’s leading-edge 3DFabric advanced packaging platforms such as InFO enable our many mutual customers to achieve truly remarkable and industry-disrupting innovations.”
Siemens said its automated design workflows for TSMC’s InFO_oS and InFO_PoP technologies are driven by the heterogeneous integration cockpit capabilities of the Innovator3D IC solution and includes Xpedition Package Designer software, HyperLynx DRC, and Calibre nmDRC software technologies, which are all industry leaders in semiconductor package design.
Source: Siemens
