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Texas Instruments Introduces TICS100MOD Module and TIOM2212 IO-Link Master for Connected Factories

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Texas Instruments Incorporated has introduced the TICS100MOD multiprotocol communications module and TIOM2212 IO-Link master for connected factory networks. The TICS100MOD supports EtherCAT, EtherNet/IP and Profinet on a single piece of hardware.

Connected factories use multiple industrial communication protocols to exchange data between equipment on the production floor. Supporting different protocols typically requires separate hardware for each one, increasing cost, design complexity and development time, according to TI.

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Texas Instruments Introduces TICS100MOD Module and TIOM2212 IO-Link Master for Connected Factories

Built on TI's AM2612 microcontroller and DP83826AI Ethernet physical layer, the TICS100MOD is a system-on-module (SoM) that TI describes as the industry's smallest fully featured, certified communications SoM. Engineers can switch among EtherCAT, EtherNet/IP and Profinet at boot through a firmware update. The module integrates two Arm Cortex-R5F cores and external memory to support protocol stacks and factory automation applications.

The dual-channel TIOM2212 connects IO-Link devices at the sensor and actuator level to higher-level Industrial Ethernet networks. It includes analog integration and built-in protection features, and is compatible with TI's Sitara industrial networking system-on-chip family and AM13Ex real-time MCUs through an integrated frame handler.

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Karim Jamal, director of Industrial Communication Solutions at TI, said engineers need support adapting to emerging standards and requirements as industrial communication evolves. He said TI combines hardware, software and in-house engineering expertise for industrial automation systems operating across devices, networks and protocols.

Preproduction quantities of the TIOM2212 are available on TI.com, and the TICS100MOD is expected by year-end 2026. TI will show the TICS100MOD at electronica 2026, November 10-13 in Munich, Germany, in Hall C4, booth 159. TI also lists an industrial communication SDK and the TIOL221 evaluation module as development resources.

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EEHerald News Desk


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