onsemi unveiled the Embedded Power Platform (EPP), an architecture that uses the silicon wafer itself as the foundation of the package and applies a highly integrated approach to power system design across automotive, industrial and AI data center markets.
The platform integrates multiple dies into a single silicon device and jointly optimizes electrical, mechanical and thermal performance within a single architecture. EPP enables up to 3 – 5x higher power density compared with current solutions and supports a highly integrated approach to power system design. This helps customers reduce complexity while scaling for the increasing demands of AI infrastructure and electrification.
“For decades, the semiconductor and the package have been treated as separate technologies. EPP changes that by making the silicon itself part of the system architecture,” said Hassane El-Khoury, President and CEO of onsemi. “EPP brings together advanced semiconductor technologies, manufacturing and system-level optimization into a common architecture that can evolve alongside future innovations. This approach can redefine how power systems are built and create a new foundation for AI infrastructure, electrification and automation.”
EPP treats the package as an active contributor to system performance. By using the silicon wafer itself as the package, it enables the integration and interconnection of silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies within a wafer-level architecture. Multiple devices, including FETs, drivers and controllers, can be embedded together in a single package and co-optimized for electrical, thermal and mechanical performance. This supports complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimized together from the start. The approach produces higher power density, improved system performance, reduced development complexity and faster time-to-market.
EPP leverages onsemi’s standard 12-inch silicon wafer manufacturing capabilities and brings key integration processes into the semiconductor fab. It applies mature semiconductor design tools, wafer-level manufacturing and advanced simulation capabilities to power-system integration.
Subaru Corporation is one of the first early engagement partners for EPP and is working with onsemi to evaluate how the platform could support future electrified vehicle architectures. Through the collaboration, Subaru will gain early access to engineering samples, simulation models and technical expertise as the companies explore opportunities to improve vehicle performance, streamline development and accelerate innovation.
AI infrastructure, electrified transportation and industrial automation are competing for power as a critical resource. Customers need to move and manage more electricity within increasingly compact systems while controlling heat, efficiency, cost and development time. Many of today’s power systems are developed using traditional approaches that treat power electronics, mechanical design and thermal design as separate engineering challenges optimized independently and sequentially. Decisions made at one stage can create compromises in another, leading to additional engineering iterations, costly late-stage changes and longer development cycles.
EPP replaces that sequential model with a common platform that can be co-designed, co-simulated and co-optimized. This approach is designed to help customers:
- Achieve 3 – 5x higher power density, depending on the application
- Accelerate development cycles to as little as four months
- Improve thermal performance and heat dissipation
- Reduce electrical losses through lower parasitic inductance
- Enable greater device control and higher switching frequencies
- Identify design trade-offs earlier and reduce costly late-stage changes
- Scale a common architecture across power levels, device types, applications and semiconductor technologies
In AI infrastructure applications, as AI rack power increases, more space and cooling capacity must be dedicated to the systems that deliver, convert and protect that power. This can limit how much compute capacity can fit within a rack. In an early EPP-based solid-state circuit-breaker design, the solution was approximately 50% smaller and 20% cooler than existing designs. By reducing packaging overhead and using the full EPP footprint to conduct heat, EPP can support more compact power systems, improve thermal management and enable greater power density in AI infrastructure.
In electric vehicle applications, traction inverters are often constrained by efficiency losses, thermal limitations, development complexity and system size. EPP addresses these with up to 4x higher power density and 15% lower power losses compared to conventional approaches, enabling smaller, lighter and more efficient inverter designs. Its scalable architecture supports a single inverter platform spanning low-end to high-end vehicle applications, allowing automakers to reuse a common design across multiple vehicle models and power classes. This approach can reduce R&D and manufacturing costs, accelerate qualification and development cycles, improve vehicle range or lower system costs, and help bring new vehicle programs to market faster.
EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants across automotive and AI applications.
