Business
450 mm is the next path to profit for top semiconductor players
The key factor of success for large scale semiconductor manufacturers around the world is volume manufacturing of integrated circuits at lesser and lesser cost. The cost is reduced by offering more number of transistors for the same price, and offering IC chip at lesser price by making more number
3 min readeASIC gets $23.5M growth capital financing
eASIC Corporation has announced that it has closed a $23.5M growth capital financing. The funding includes investment from Khosla Ventures, Kleiner Perkins Caufield and Byers, Crescendo Ventures, Seagate Technology and Evergreen Partners. eASIC saif it will use the capital to fund expansion of its U
2 min readBing Xie appointed as VP of TI's worldwide sales and marketing
Texas Instruments has announced Bing Xie’s election as vice president of the company. “Bing’s sales experience in both Asia and the Americas combined with his strong customer relationships and proven track record in building cohesive teams will benefit our worldwide sales organization,” said Joh
2 min readTerm loan facility to Freescale rised to $800M from $300M
Freescale Semiconductor said it has been advised by the arrangers under its proposed new senior secured term loan facility that they have received sufficient orders to upsize the proposed new term loan facility to $800 million from the original $300 million proposed at the outset of the offering. Th
3 min readSemiconductor equipment market to see big jump in 2014
The semiconductor fab equipment market is heading for a big growth in 2014. SEMI, the industry Association for semiconductor equipment manufacturers has forecasted the capital expenditure for semiconductor fab equipment spending will increase to US$ 39.8 billion in 2014, the highest on record.
4 min readimec and Veeco partner in cost-reduction of GaN-on-Si power devices
imec and Veeco Instruments are collaborating on a project aimed at lowering the cost of producing gallium nitride on silicon (GaN-on-Si) -based power devices and LEDs. Barun Dutta, imec’s Chief Scientist, commented, “The productivity, repeatability, uniformity and crystal quality of Veeco’s met
2 min readEntegris and Imec creating solutions for handling very thin wafers
Entegris and imec are working together in creating solution to handle different types of semiconductor wafers to assemble them into 3 dimensionally packaged device. 3-D IC manufacturing requires thinner semiconductor wafers which need to be bonded to carrier substrates. Handling such thin wafers in
2 min readJapan looses its hold on top semiconductor ranking
In the electronics and semiconductor business, Japan holds a top position in many areas. But in the past two decades, its stronghold on the electronics and semiconductor industry is coming down. In semiconductor area, the companies from Japan occupy 4 to 5 positions in the top-10 ranking consistentl
6 min readVanadium dioxide explored as a very-fast switch between insulator/conductor
Physics researchers at the University of Washington are experimenting with a material called vanadium dioxide to find its triple point properties. The triple point is a condition at which the material can exist in different states. Researchers are trying to find the switching properties of vanadium
2 min readNew materials, processes developed for SiP assembly
Infineon has announced, group of companies in Europe working on building solutions for System in Package (SiP) assembly of electronic components have successfully come out with solutions. To build electronic subsystems, the process of traditional printed circuit assembly is time-consuming, spac
4 min readSupply chain initiative to connect small and big companies in US
The success of advanced manufacturing is in efficient-management of supply chain. IT systems play a central role in having a big database of products from thousands of manufacturers and suppliers. Components can be selected and managed easily and efficiently using networked information management s
4 min readN.American semi equipment industry posts July 2013 B-t-B of 1.0
As per the latest SEMI reports, North America-based manufacturers of semiconductor equipment posted $1.27 billion in orders worldwide in July 2013 (three-month average basis) and a book-to-bill ratio of 1.00. The three-month average of worldwide bookings in July 2013 was $1.27 billion. The book
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Our Editors dive into topical news, new products, and discuss the shifting architecture of the global semiconductor industry.
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