New materials, processes developed for SiP assembly

Infineon has announced, group of companies in Europe working on building solutions for System in Package (SiP) assembly of electronic components have successfully come out with solutions. To build electronic subsystems, the process of traditional printed circuit assembly is time-consuming, space consuming and also expensive. Best idea is to put most of the functions on the silicon chip itself. But there is a technology limitation for integrating sensors, RF, LEDs and any such non-silicon-based electronic components which includes passive components such as resistor capacitor and inductor on the single semiconductor IC. So the better option is to place all these different types of components one next to the other or one above the other or it can be a combination of both vertical and horizontal integration. These components are bonded and wired together using different materials, different processes, compared to the way they are connected on a printed circuit board. The idea here is to use less human interface in building the subsystem and to use semiconductor packaging equipments/machines for multi-device assembly. Infineon and its partners have successfully developed new materials, processes, test procedures for building system in package devices, what is called as embedded system in package (ESiP). Infineon said they have developed SiP, which is more compact and reli...