Valeo and Calyos have signed a Memorandum of Understanding (MoU) to develop and industrialize high-performance, standalone chip cooling solutions using passive advanced two-phase technology. The partnership addresses rising thermal challenges in the mobility sector, including vehicle electrification and Software Defined Vehicles (SDV), as well as in the data center market driven by Artificial Intelligence (AI) requirements. The solutions combine Calyos’ Loop Heat Pipe (LHP) expertise with Valeo’s thermal systems engineering, industrial capabilities, and global presence.
The passive advanced two-phase cooling systems are designed to manage high heat flux. They are compact, easy to integrate, maintenance-free, and highly reliable. The technology serves as an addition to Valeo’s existing portfolio of thermal management solutions for data centers and vehicle power electronics.
Applications in Mobility
In automotive applications, the cooling solution targets power electronics such as On-Board Chargers (OBC), inverters, and “x-in-1” integrated systems. It provides autonomous, plug-and-play cooling, particularly beneficial for electronics on the back side of the vehicle by enabling energy savings and simplification of the cooling architecture.
For Software Defined Vehicles, the solution supports centralized computing controllers with high power density. It offers standalone, compact, and reliable heat dissipation for high-speed processors without relying on traditional distributed vehicle liquid cooling loops.
Applications in Data Centers
The collaboration extends to data centers, where AI acceleration is increasing rack and chip power levels and demand for direct-to-chip cooling. The joint solution is a smart two-phase passive chip cooling system that operates without active parts such as pumps.
Key features for data centers include:
- Energy efficiency through the two-phase loop heat pipe effect to handle higher processor power and heat flux.
- Ease of retrofit for existing air-cooled servers via standalone two-phase loop heat pipe air-cooled units per server, allowing power density upgrades without full facility overhauls.
- Reliability and compactness with a passive system that reduces maintenance needs and leak risks compared to traditional water-cooling methods due to lower dielectric fluid pressure.
Xavier Dupont, Valeo Power Division Chief Executive Officer, said the cooperation integrates Calyos’ Loop Heat Pipe expertise into Valeo’s ecosystem to provide easy-to-integrate and scalable cooling solutions for automotive and data center customers while enhancing energy efficiency.
Antoine de Ryckel, Calyos Chief Executive Officer, and Olivier de Laet, Calyos founder, stated that partnering with Valeo enables scaling their technology to a global industrial standard to meet cooling demands in the AI era and next-generation electric vehicles.
