Sivers Semiconductors AB announced a strategic collaboration with GlobalFoundries to develop advanced silicon photonics solutions for the AI infrastructure market. Under the agreement, Sivers’ laser arrays will be integrated into reference designs built on GlobalFoundries’ silicon photonics platform. The collaboration covers a range of optical connectivity architectures, including co-packaged optics (CPO), linear pluggable optics (LPO), and other emerging data center interconnect solutions.
Sivers’ laser arrays will also be available in GlobalFoundries’ Silicon Photonics Co-packaged Advanced Light Engine (SCALE) platform for next-generation optical sub-assemblies and light engine architectures. GF’s SCALE CPO solution combines integrated photonic devices, coarse and dense wavelength-division multiplexing (CWDM, DWDM), and advanced packaging enablement to support improved bandwidth density and system scalability.
The partnership targets the pluggable optics market, which is projected to reach $25 billion by 2030.
“The rapid expansion of AI workloads and hyperscale data center architectures demand advanced photonics technologies that deliver higher bandwidth, improved energy efficiency, and scalable optical connectivity,” said Raymond Biagan, CRO at Sivers Semiconductors. “Our collaboration with GlobalFoundries positions both companies at the leading edge of silicon photonics innovation.”
“GlobalFoundries continues to see strong momentum for silicon photonics solutions as AI data center architectures evolve toward higher bandwidth density and improved power efficiency,” said Vikas Gupta, Senior Fellow, Silicon Photonics Product Line at GlobalFoundries. “Pairing Sivers Semiconductors’ laser array technology with our silicon photonics and SCALE CPO platforms provides our customers with advanced, scalable optical engine solutions for high-bandwidth co-packaged optics and optical interconnects.”
