Global semiconductor equipment billings reached US$36.55 billion in the first quarter of 2026, a record quarterly figure, according to the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report from SEMI.
The total represents a 14% increase year-over-year and 1% growth quarter-over-quarter.
Record billings were driven by continued AI-related investment, including capacity expansion and technology upgrades supporting leading-edge logic, DRAM, and advanced packaging.
“The strong start to 2026 reflects continued industry investment in the capacity and infrastructure needed to support AI-driven semiconductor growth,” said Ajit Manocha, SEMI President and CEO. “Record first-quarter billings highlight ongoing momentum in leading-edge manufacturing and advanced packaging.”
The following regional breakdown for Q1 2026 (in billions of U.S. dollars), with quarter-over-quarter and year-over-year changes, is as follows:
-China: $10.99 billion (−16% QoQ, +7% YoY)
- Korea: $8.93 billion (+26% QoQ, +16% YoY)
- Taiwan: $8.77 billion (+18% QoQ, +24% YoY)
- North America: $3.28 billion (+6% QoQ, +12% YoY)
- Japan: $2.16 billion (−24% QoQ, −1% YoY)
- Europe: $0.95 billion (+28% QoQ, +9% YoY)
- Rest of the World: $1.48 billion (−25% QoQ, +43% YoY)
Total: $36.55 billion (+1% QoQ, +14% YoY)
The WWSEMS report compiles data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ). It summarizes monthly billings figures for the global semiconductor equipment industry. Note that summed subtotals may not equal the total due to rounding.
