Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) under the European Chips Design Platform (EuroCDP) project. The agreement provides companies accepted into the Chips JU program with access to Siemens’ electronic design automation (EDA) software under pre-defined pricing and conditions. It aims to lower barriers for smaller companies, startups, and research institutions to use advanced design, verification, and manufacturing tools.
Jean-Marie Saint Paul, senior vice president, EDA Global Sales, Siemens EDA, Siemens Digital Industries Software, stated that the agreement creates a more level playing field for innovation in the European semiconductor ecosystem.
Jari Kinaret, Executive Director of the Chips Joint Undertaking, said the contract with Siemens is a key enabler for the Design Platform, which supports the capacity build-up under the Chips Act and helps European startups and SMEs develop into fabless businesses.
The collaboration enables EuroCDP participants to accelerate innovation cycles, reduce development costs, focus on design and innovation instead of procurement negotiations, access comprehensive digital twin capabilities and AI-driven design tools, and achieve cost predictability for R&D budget management.
